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The true workhorse of the SIL PAD product family, SIL PAD900S (SP900S)thermally conductive insulation material
is designed for a wide variety of applications requiring high thermal performance and electrical isolation.
These applications also typically have low mounting pressures for componentclamping.
SIL PAD 900S (SIL PAD TSP 1600S)material combines a smooth and highly compliant surface characteristic with
high thermalconductivity. These features optimize the thermal resistance properties at low pressures.
Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247
and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount
of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal
resistance and maximizes thermal performance.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive
